My research focused on interfacial reliability in semiconductor packaging, mechanical properties of thin films, and fully freestanding nanofilms. The goal is to map the interfacial adhesion energy in Front-End-of-Line (FEOL) and Back-End-of-Line (BEOL) structures and manufacture transferrable advanced freestanding devices.
I have been a Ph.D. student in Professor Taek-Soo Kim's group (Advanced Packaging and Thin Film Laboratory) at the department of mechanical engineering, KAIST, since 2022.
Education
2022.03 - 2026.02 (predicted)
Ph. D.
KAIST, Korea
Department of Mechanical Engineering, KAIST, Daejeon, Korea
Advisor: Prof. Taek-Soo Kim
-Thesis: Freestanding Nanofilms Fabrication and Advanced Transfer
2020.03 - 2022.02
M. S.
KAIST, Korea
(Summa cum laude 4.3 / 4.3)
Department of Mechanical Engineering, KAIST, Daejeon, Korea
Advisor: Prof. Taek-Soo Kim
-Thesis: Mechanical Reliability of Cu Interconnects - SiCN Capping Layer Interface by Surface Treatments
2016.03-2020.02
B. S.
Hanyang University, Korea
(Summa cum laude 4.45 / 4.5)
Department of Mechanical Engineering, Hanyang University, Seoul, Korea
Advisor: Prof. Sung Wook Park
-Thesis: Diesel Injector Injection Rate Measurement
Awards and Honors
2024. 08. KAIST Humanity Scholarship Award (Achievement Category).
2023. 06. IEEE ECTC Student Travel Grant Award (Link)
2022. 11. KAIST Department of Mechanical Engineering Master's Program Excellence Award
2022. 08. Kim Young-Han Global Leader Scholarship
2022. 04. Microelectronics and Packaging Conference BEST Paper Presentation Award
2021. 11. ISMP 2021 Young Scientist Award
2020. 02. Dean's Award (공과대학 학장상), College of Engineering, Hanyang University
2020. 02. Outstanding Graduate Award
2018. 09. Academic Excellence Award
2018. 03. National Science and Engineering Scholarship, Ministry of Science and ICT
2018. 03. Academic Excellence Award
2017. 09. Academic Award
2017. 06. Guwon Scholarship Award
2017. 06. Excellence Award, Engineering Design Competition, College of Engineering, Hanyang University
2017. 03. Academic Excellence Award
2016. 09. Academic Excellence Award
2022. 03. Korea Student Aid Foundation (KOSAF): Granted tuition (Ph. D. course)
- Current
2020. 03. Korea Student Aid Foundation (KOSAF): Granted tuition (M. S. course)
- 2022. 02.
2025.03 School of Semiconductor Technology, Semiconductor Project Assistant
- 2025. 06.
Publication
[First author]
1. J .-W. Lee†, G.-U. Kim†, D. J. Kim†, Y. Jeon, S. Li, T.-S. Kim*, J.-Y. Lee*, B. J. Kim*, "Intrinsically-Stretchable Organic Solar Cells Achieved by High-Molecular-Weight, Electro-Active Polymer Acceptor Additives", Advanced Energy Materials, 2200887, 2022
2. J. Kim†, G.-U. Kim†, D. J. Kim†, S. Lee, D. Jeong, S. Seo, S.-J. Ko*, S. C. Yoon*, T.-S. Kim*, and B. J. Kim*, "Development of rigidity-controlled terpolymer donors for high-performance and mechanically robust organic solar cells", Journal of Materials Chemistry A, 11, 4808, 2023.
3. C. Lim†, S. Park†, D. J. Kim†, J.-W Lee, J. Su. Park, S. Seo, D. Kim, F. S. Kim*, T.-S. Kim*, and B. J. Kim *, "Design of Mechanically-Robust Naphthalenediimide-based Polymer Additives for High-Performance, Intrinsically-Stretchable Polymer Solar Cells", Journal of Materials Chemistry A, 11(37), 20031-20042, 2023.
4. D. J. Kim, S. Kang, S. W. Lee, I. Lee, S. Park, J. Lee, J. J. Kim, and T.-S. Kim*, “Optimization of Cu interconnects-SiCN interfacial adhesion by surface treatments", IEEE Electronic Components and Technology Conference, 367-373, 2023. (2023 Student Travel Grant Award)
5. HJ. Kim†, D. J. Kim†, J. P. Baek, W. J. Kim, S. Kim, and T.-S. Kim*, "Intrinsic Thermo-Mechanical Properties of Freestanding TEOS-SiO2 Thin Films Depending on Thickness", ACS Applied Electronic Materials, 6, 5293-5300, 2024.
6. D. J. Kim†, S. Kang†, S. W. Lee, I, Lee, S. Park, J. Lee, J. J. Kim, and T.-S. Kim*, "Effects of Surface Treatments for the Adhesion Improvement between Cu and SiCN in BEOL Interconnect", Surfaces and Interfaces, 51, 104734, 2024.
7. D. J. Kim, S. W. Lee, S. Sung, I, Lee, S. Park, J. Lee, J. J. Kim, S. Kang*, and T.-S. Kim*, "Role of loading mode on crack propagation behavior and adhesion at Cu-SiCN interface", Applied Surface Science, 688, 162461, 2025.
8. D. J. Kim, S. W. Lee, W. Choi, H. J. Chang, I. Lee, S. Park, J. Lee, J. J. Kim, S. Kang*, and T.-S. Kim*, "Identifying the weakest interface in BEOL structures", Applied Surface Science, 163228, 2025.
9. S. W. Lee†, D. J. Kim†, and T.-S. Kim*, “Effect of W nucleation process on the adhesion of W/TiN/SiO2 structures for BEOL interconnects", Applied Surface Science, Under Review.
10. D. J. Kim†, S. W. Lee†, H. Lee and T.-S. Kim*, “Effect of Nucleation-Stage Reducing Agents on Residual Stress in CVD Tungsten Thin Films", IEEE Transactions on Electron Devices, Under Review.
11. D. J. Kim, D. Kim, S. Kang*, and T.-S. Kim*, “Difference between the phase angle within the thin film and the test method", to be submitted.
12. D. J. Kim, D. Kim, W. Choi, Y. S. Ham, S. Kang, and T.-S. Kim*, “Crack propagation analysis in DCB test", in preparation.
13. D. J. Kim†, Y. S. Ham†, and T.-S. Kim*, “Adhesion Measurements and Improvement Strategies for Thin Film Structures: A Comprehensive Review", to be submitted.
14. D. J. Kim†, J.-W. Lee†, T. Y. Kang, B. S. Ma*, B. J. Kim* and T.-S. Kim*, “Importance of Molecular Weight of Conjugated Polymer Thin Films on Thermo-mechanical Reliability of Stretchable Organic Semiconductors", to be submitted.
[Co-author]
15. J. –W. Lee†, D. Jeong†, D. J. Kim, T. N-L. Phan, J. S. Phan, J. S. Phan, T.-S. Kim and B. J. Kim *, “Flexible-Spacer Incorporated Polymer Donors Enable Superior Blend Miscibility for High-Performance and Mechanically-Robust Polymer Solar Cells”, Energy & Environmental Science, 2021.
16. S. Song, E. Y. Park, B. S. Ma, D. J. Kim, H. H. Park, Y. Y. Kim, S. S. Shin, N. J. Jeon, T.-S. Kim and J. Seo*, "Selective Defect Passivation and Topographical Control of 4‐Dimethylaminopyridine at Grain Boundary for Efficient and Stable Planar Perovskite Solar Cells". Advanced Energy Materials, 11, 2003382, 2021.
17. J.-W. Lee†, N. Choi†, D. J. Kim, T. N-L. Pahn, H. Kang, T.-S. Kim, and B. J. Kim*, “Side Chain Engineered Naphthalene Diimide-based Terpolymer for Efficient and Mechanically Robust All-Polymer Solar Cells". Chemistry of Materials, 33(3), 1070-1081, 2021.
18. J.-W. Lee†, C. Sun†, D. J. Kim, M. Y. Ha, D. Han, J. S. Park, C. Wang, W. B. Lee*, S.-K. Kwon*, T.-S. Kim*, Y.-H. Kim* and B. J. Kim*, "Donor–Acceptor Alternating Copolymer Compatibilizers for Thermally Stable, Mechanically Robust, and High-Performance Organic Solar Cells", ACS Nano, 15(12), 19970-19980, 2021.
19. Q. Chen†, Y. H. Han†, L. R. Franco, C. F. N. Marchiori, Z. Genene, C. M. Araujo, J.-W. Lee, T. N.-L. Phan, J. Wu, D. Yu, D. J. Kim, T.-S. Kim, L. Hou*, B. J. Kim*, E. Wang* " Effects of Flexible Conjugation-Break Spacers of Non-Conjugated Polymer Acceptors on Photovoltaic and Mechanical Properties of All-Polymer Solar Cells", Nanomicro Letter, 14, 164, 2022.
20. S. J. Sung, J. Im, G. Kim, C. S. Moon, J. J. Yoo, S. S. Shin, N. J. Jeon, B. S. Ma, D. J. Kim, T.-S. Kim, J. Seo*, "Molecular Engineering for Function-Tailored Interface Modifier in High-Performance Perovskite Solar Cells", Advanced Energy Materials, 12(27), 2200758, 2022.
21. B. Oh†, Y.-S. Lim†, K. W. Ko, H. Seo, D. J. Kim, D. Kong, J. M. You, H. Kim, T.-S. Kim, S. Park, D.-S. Kwon, J. C. Na, W. K. Han, S.-M, Park*, and S. Park*, "Ultra-soft and highly stretchable tissue-adhesive hydrogel based multifunctional implantable sensor for monitoring of overactive bladder", Biosensors and Bioelectronics, 115060, 2023.
22. S. Seo†, J.-W. Lee†, D. J. Kim, T. N.-L. Phan, J. Park, T.-S. Kim, and B. J. Kim*, "Poly(dimethylsiloxane)-block-PM6 Polymer Donors for High-Performance and Mechanically-Robust Polymer Solar Cells", Advanced Materials, 35(24), 2300230, 2023.
23. H.-Y. Jung, E. S. Oh, D. J. Kim, H. Shim, W. Lee, S.-G. Yoon, J. Lim, J. S. Yun, T.-S. Kim, and T.-Y. Yang*, "Adjusted Bulk and Interfacial Properties in Highly Stable Semitransparent Perovskite Solar Cells Fabricated by Thermocompression Bonding between Perovskite Layers", ACS Applied Materials & Interfaces, 15(26), 31344-31353, 2023.
24. H. Jin, K. Kim, S. Park, J. Rhee, H. Ahn, D. J. Kim, K. Kim, J. H. Noh, T.-S. Kim, E.-Y. Shin, and H. J. Son*, "Chemically Recyclable Conjugated Polymer and One-Shot Preparation of Thermally Stable and Efficient Bulk-Heterojunction from Recycled Monomer", Advanced Functional Materials, 33(47), 2304930, 2023.
25. G.-U. Kim†, C. Choi†, D. Jeong†, D. J. Kim, T. N.-L. Phan, S. Song, J. Park, T.-S. Kim, Y.-H. Kim*, and B. J. Kim *, "Highly Efficient and Robust Ternary All-Polymer Solar Cells Achieved by Electro-Active Polymer Compatibilizers", Advanced Energy Materials, 13(39), 2302125, 2023.
26. J. Kim†, G.-U. Kim†, D. J. Kim†, S. Lee, D. Jeong, S. Seo, S.-J. Ko*, S. C. Yoon*, T.-S. Kim*, and B. J. Kim*, "Development of rigidity-controlled terpolymer donors for high-performance and mechanically robust organic solar cells", Journal of Materials Chemistry A, 11, 4808, 2023.
27. J.-W. Lee†, C. Sun†, J. Lee, D. J. Kim, W. J. Kang, S. Lee, D. Kim, J. Park, T. N.-L. Phan, Z. Tan, F. S. Kim, J.-Y. Lee, X. Bao, T.-S. Kim, Y.-H. Kim* and B. J. Kim*, "Design of Star-Shaped Trimer Acceptors for High-Performance, Photostable, and Mechanically-Robust Organic Solar Cells", Advanced Energy Materials, 14(8), 2303872, 2024.
28. J.-W. Lee†, C. Sun†, S. Lee, D. J. Kim, E. S. Oh, T. N.-L. Phan, T. H.-Q. Nguyen, S. Seo, Z. Tan, M. J. Lee, J.-Y. Lee, X. Bao, T.-S. Kim, C. Lee*, Y.-H. Kim*, and B. J. Kim*, "High-Performance Intrinsically Stretchable Organic Solar Cells Based on Flexible Spacer Incorporated Dimerized Small-Molecule Acceptors", Nano Energy, 109541, 2024.
29. T.-I. Lee†, J. H. Kim†, D. J. Kim, and T.-S. Kim*, "Evaluating Free Thermal Expansion and Glass Transition of Ultrathin Polymer Films on Heated Liquid", ACS Applied Materials & Interfaces, 16(23), 30336-30343, 2024.
30. C. Lim†, J.-W. Lee†, D. J. Kim, D. Han, T. N.-L. Phan, S. Lee, T.-S. Kim, and B. J. Kim* "Tetramerized Small-Molecule Acceptor for Organic Solar Cells with Enhanced Efficiency, Stability and Mechanical Robustness: Impact of Chain Length and Dispersity Effects", Advanced Functional Materials, 2409764, 2024
31. S. Kang, J. Chang, D. J. Kim, T.-S. Kim, K. C. Choi, J. H. Lee, and S. Kim* "Graphene-enabled laser-off for ultrathin displays", Nature Communications, 15, 8288, 2024.
32. E.-Y. Shin, J. Park, D. J. Kim, S. H. Park, K. Kim, E. Go, K. Kim, H. Jin, J. S. Kim, J. H. Noh, S.-W. Baek, B. Chae, T.-S. Kim, E. Lee, S. Chung, Y. H. Jang and H. J. Son* “Highly mechanically stable and intrinsically stretchable large-area organic photovoltaics using nanoporous bulk-heterojunction”, Chemical Engineering Journal, 499, 156116, 2024.
33. E. C. Chae, Y.-H. Seo, B. J. Kang, J. H. Oh, Y. Jung, J. Jang, T. Kim, Y.-R. Jo, D. J. Kim, T.-S. Kim, S. H. Im, S. J. Sung, S. S. Shin*, S. Hong*, J. J. Nam* "PTAA-Infiltrated Thin-Walled Carbon Nanotube Electrode with Hidden Encapsulation for Perovskite Solar Cells", EcoMat, 2024.
34. J.-W. Lee†, Ki. Bae†, D. J. Kim, S. Lee, S. Lee, J.-Y. Lee, T.-S. Kim, and B. J. Kim* "Dual-Percolative Planar-Heterojunction Photoactive System for High-Performance Stretchable Organic Photovoltaics Enhancing Power Output Under Strain", Advanced Energy Materials, 2025 (Submitted).
Patents
1. T.-S. Kim, D. J. Kim, and Y. Kim, Method for Manufacturing a Freestanding Membrane and Method for Forming an Electroplating Layer Using a Freestanding Membrane, Domestic patent, 10-2025-0016907.
2. T.-S. Kim, D. J. Kim, Method for Forming a Thin Film using a Free Standing Membrane, Domestic patent, 10-2025-0052407.
3. T.-S. Kim, D. J. Kim, S. Sung, Method for Manufacturing a Free Standing Pattern Structure, Domestic patent, 10-2025-0052466.
4. T.-S. Kim, D. J. Kim, S. Sung, Method for Transferring a Thin Film using a Free Standing Membrane, Domestic patent, 10-2025-0052414.
5. T.-S. Kim, D. J. Kim, Method for Measuring Mechanical Property of Thin Film, Domestic patent, 10-2025-0065115, 2025.
6. T.-S. Kim, D. J. Kim, Direct Delamination of Silicon Oxide Films from Copper Substrates Using Hydrochloric Acid for Freestanding Thin Film Fabrication and Tensile Testing Applications, Domestic patent, 2025.
7.
Conference
1. D. J. Kim, S. Kang, S. W. Lee, I. Lee, S. Park, J. S. Lee, J. Lee, J. J. Kim, and T.-S. Kim, "Optimization of Cu Interconnects-SiCN Interfacial Adhesion by Surface Treatments", The 19th International Symposium on Microelectronics and Packaging (ISMP), Busan, Korea, Nov. 3-5, 2021. (Oral) (Young Scientist Award)
2. S. W. Lee, D. J. Kim, J. Jeon, W.J. Yun, T.-S. Kim, and T.-S. Kim, "Investigation on the Mechanical Reliability of TiN/SiO2 for W Nucleation Processes", The 19th International Symposium on Microelectronics and Packaging (ISMP), Busan, Korea, Nov. 3-5, 2021. (Oral)
3. E. S. Oh, D. J. Kim, T.-I. Lee, D. Lee, H. Park, J.-W. Lee, B. J. Kim and T.-S. Kim, "Thermo-mechanical behavior of poly(3-hexylthiophene-2,5-diyl) thin films for flexible and stretchable electronics", The 20th International Symposium on Microelectronics and Packaging (ISMP), Busan, Korea, Nov. 9-11, 2022. (Oral)
4. D. J. Kim, S. W. Lee, S. Kang, I. Lee, S. Park, J. S. Lee, J. Lee, J. J. Kim, T.-S. Kim, "Optimization of Cu Interconnects - SiCN Interfacial Adhesion by Surface Treatments", 2023 IEEE 73rd Electronic Components and Technology Conference, Orlando, USA, May 30 - June 2, 2023. (Oral) (2023 ECTC Student Travel Award Winner)
5. H. J. Kim, D. J. Kim, and T.-S. Kim, "Mechanical Properties of TEOS Thin Film", ICEM20 - 20th International Conference on Experimental Mechanics, Porto, Portugal, July 2-7, 2023. (Oral)
6. D. J. Kim, Y. H. Kim, and T.-S. Kim, "Fabrication of Robust Freestanding Gold Membrane by Heat Treatment", Advanced Epitaxy for Freestanding Membranes and 2D Materials (AEFM) Conference 2023, Seoul, Korea, Jul. 10-12, 2023. (Poster)
7. D. J. Kim, H. J. Kim and T.-S. Kim, "Study on the Intrinsic Thermo-mechanical Properties of TEOS-SiO2 Thin Films through Etching of Naturally Formed Copper Oxide", The 22nd International Symposium on Microelectronics and Packaging joined with the 18th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics (ISMP-IRSP 2024), Busan, Korea, Nov. 5-8, 2024. (Oral)
8. D. J. Kim, S. W. Lee, W. Choi, H. J. Chang, S. Kang and T.-S. Kim, "Interfacial adhesion mapping in BEOL structures", The 3rd Global conference of Innovation Materials & MRS-K Spring Meeting, Jeju, Korea, June 15-19, 2025. (Poster)
9. D. J. Kim, S. W. Lee, W. Choi, H. J. Chang, S. Kang and T.-S. Kim, "Comprehensive Interface Adhesion Characterization for Advanced Semiconductor Packaging", International Microsystems, Packaging, Assembly and Circuits Technology Conference, TaiNEX, Taipei, Taiwan, Oct. 21-24, 2025. (Oral)
10. J. Nam, D.-M. Kim, D. J. Kim, T.-S. Kim and B. J. Lee, "Tuning substrate permittivity for enhanced plasmon thermal conductivity", The 11th JEMS-KSME Thermal and Fluids Engineering Conference (J-K TFEC11), Okinawa, Japan, Oct. 22-25, 2025.
Contact
Address
291 Daehak-ro, Yuseong-gu,
Daejeon, 34141, Republic of Korea
Contact
042-350-3278
Advisor: tskim1@kaist.ac.kr
